Boosting CPV/T efficiency with conductive encapsulants and microchannel cooling: hybrid numerical-experimental analysis Articles uri icon

publication date

  • November 2025

start page

  • 1

end page

  • 13

issue

  • Part D, 127455

volume

  • 278

International Standard Serial Number (ISSN)

  • 1359-4311

Electronic International Standard Serial Number (EISSN)

  • 1873-5606

abstract

  • This study presents a novel CPV/T system integrating thermally conductive encapsulant materials and a DL-MCHS cooling design. Using 3D conjugate heat-transfer CFD and experimental validation, it analyzed CF and PF flow configurations under varying flow rates and concentration ratios. Results show CF offers superior thermal uniformity and higher electrical efficiency, while PF achieves greater cooling gradients. Increasing flow rates improved both thermal and electrical performance, with CFD¿experiment deviations below 1%. At higher concentration (CR = 10), enhanced cooling was essential, and the SiC-based encapsulant improved heat transfer, raising outlet coolant temperature by ~5%.

subjects

  • Renewable Energies

keywords

  • concentrated photovoltaic (cpv); numerical simulation; experimental analysis; thermal management; encapsulant