A Thermo-Viscoplastic Constitutive Model for FCC Metals with Application to OFHC Copper Articles uri icon

publication date

  • February 2010

start page

  • 120

end page

  • 135

issue

  • 2

volume

  • 52

International Standard Serial Number (ISSN)

  • 0020-7403

Electronic International Standard Serial Number (EISSN)

  • 1879-2162

abstract

  • In this paper a physical-based constitutive relation for defining the thermo-viscoplastic behaviour of FCC metals with dependence on strain on thermal activation processes is presented. The model, based on previous
    considerations reported by Rusinek and Klepaczko [Rusinek A, Klepaczko
    JR. Shear testing of sheet steel at wide range of strain rates and a
    constitutive relation with strain-rate and temperature dependence of the
    flow stress. Int J Plasticity 2001;17:87-115], is founded on physical
    aspects of the material behaviour. The proposed constitutive relation is
    applied to define the behaviour of oxygen-free high conductivity (OFHC)
    copper using the experimental data reported in Nemat-Nasser and Li
    [Nemat-Nasser S, Li Y. Flow stress of FCC polycrystals with application
    to OFHC copper. Acta Mater 1998;46:565-77]. The description of the
    material behaviour provided by the model gets satisfactory agreement
    with the experiments. The analytical predictions of this constitutive
    description are compared with those obtained from the models due to
    Voyiadjis and Almasri [Voyiadjis GZ, Almasri AH. A physically based
    constitutive model for fcc metals with applications to dynamic hardness.
    Mech Mater 2008;40:549-63], and Nemat-Nasser and Li. This comparison
    reveals that the original formulation proposed in this paper is a
    suitable alternative to other physically based relations for modeling
    OFHC copper.