Compact and low-profile on-chip antenna using underside electromagnetic coupling mechanism for terahertz front-end transceivers Articles uri icon

publication date

  • January 2021

issue

  • 11

volume

  • 10

abstract

  • The results presented in this paper show that by employing a combination of metasurface and substrate integrated waveguide (SIW) technologies, we can realize a compact and low-profile antenna that overcomes the drawbacks of narrow-bandwidth and low-radiation properties en-countered by terahertz antennas on-chip (AoC). In addition, an effective RF cross-shaped feed structure is used to excite the antenna from its underside by coupling, electromagnetically, RF energy through the multi-layered antenna structure. The feed mechanism facilitates integration with the integrated circuits. The proposed antenna is constructed from five stacked layers, comprising metal¿silicon¿metal¿silicon¿metal. The dimensions of the AoC are 1 × 1 × 0.265 mm3. The AoC is shown to have an impedance match, radiation gain and efficiency of ¿ ¿15 dB, 8.5 dBi and 67.5%, respectively, over a frequency range of 0.20¿0.22 THz. The results show that the proposed AoC design is viable for terahertz front-end applications. © 2021 by the author. Licensee MDPI, Basel, Switzerland.

keywords

  • antenna on-chip (aoc) electromagnetic (em) coupling feeding mechanism metasurface rf front-end substrate integrated waveguide (siw); terahertz (thz)