Influence of crystallographic orientation on the void growth at the grain boundaries in bi-crystals Articles uri icon

publication date

  • March 2021

start page

  • 61

end page

  • 79


  • Marzo


  • 212

International Standard Serial Number (ISSN)

  • 0020-7683

Electronic International Standard Serial Number (EISSN)

  • 1879-2146


  • Void growth and morphology evolution in fcc bi-crystals are investigated using crystal plasticity finite element method. For that purpose, representative volume element of bi-crystals with a void at the grain boundary are considered in the analysis. Grain boundary is assumed initially perpendicular/coaxial with the straight sides of the cell. Fully periodic boundary conditions are prescribed in the representative volume element and macroscopic stress triaxiality and Lode parameter are kept constant during the whole deformation process. Three different pairs of crystal orientations characterized as hard-hard, soft-soft and soft-hard have been employed for modelling the mechanical response of the bi-crystal. Simulations are performed to study the implications of triaxiality, Lode parameter and crystallographic orientation on slip mechanism, hardening and hence void evolution. The impact of void presence and its growth on the heterogeneity of lattice rotation and resulting grain fragmentation in neighbouring areas is also analysed and discussed.


  • Industrial Engineering
  • Materials science and engineering
  • Mechanical Engineering


  • crystal plasticity; bi-crystals; void growth; stress; triaxiality; lode parameter; unit cell calculations