Parallel Plate Cavity Mode Suppression in Microstrip Circuit Packages Using a Lid of Nails Articles uri icon

publication date

  • January 2010

start page

  • 31

end page

  • 33

issue

  • 1

volume

  • 20

international standard serial number (ISSN)

  • 1531-1309

electronic international standard serial number (EISSN)

  • 1558-1764

abstract

  • The suppression of parallel plate and cavity modes in shielded microstrip circuits is presented. To this aim a textured metal lid consisting of periodically located pins known as a bed of nails is
    employed. The mode suppression has a bandwidth of more than 2:1, and it
    does not interfere much with the microstrip circuit. Thereby, this mode
    suppression technique introduces a new advantageous packaging technology
    for high frequency circuits.