IEEE Transactions on Components Packaging and Manufacturing Technology Journal

Overview

abbreviation

IEEE T COMP PACK MAN

publication venue for

Effect of packaging on supercapacitors strings modeling: proposal of functional unit defined around balancing circuit. 3:1390-1398. 2013
Bed of Springs for Packaging of Microstrip Circuits in the Microwave Frequency Range. 2:1623-1628. 2012

International Standard Serial Number (ISSN)

2156-3950

Electronic International Standard Serial Number (EISSN)

2156-3985