POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing applications

Despite the significant advances that photonic integrated circuits (PICs) offer in terms of miniaturization, power consumption and functionalities, they run into scalability and cost issues, related to the fabrication yield, the increased integration and packaging complexity, the lack of waferscale compatible processes and the lack of integration and packaging standards. Using the above novel concepts and building blocks, POLYNICES will develop a fully integrated optoelectronic FMCW THz spectrometer with THz antenna array and beam steering abilities for quality control in plastics, a 16x16 quantum processor with integrated 780 nm light source and non-linear crystals and a 24x24 quantum processor with integrated squeezed light state source.

POLYmer based electro-optic PCB motherboard integration with Si3N4 Chiplets, InP Components and Electronic ICs enabling affordable photonic modules for THz Sensing and quantum computing applications Projects