Electronic International Standard Serial Number (EISSN)
1558-2213
abstract
The papers in this special issue focus on lightwave technology on mirowave photonics. An important portion of the papers published in this special issue are an expanded version of those presented at the International Topical Meeting on Microwave Photonics 2020 (MWP2020) held in Matsue, Japan, from November 22-25, 2020. The field of Microwave Photonics keeps continuously growing and expanding. By exploiting the inherent ultrawide fractional frequency range of optical waves, the frequency reach of the field has exceeded the microwave range to include the millimeter and Terahertz wave bands. Photonic integration technology is having a disruptive effect in the field, enabling reduction of the the size and the weight of microwave photonic systems to unprecedented levels. The number of technology platforms used for microwave photonic implementations is also greatly expanding, from indium phosphide to silicon and silicon nitride, enabling important performance improvements of critical functions as well as unlocking the potential of novel structures (photonic crystal structures and graphene metasurfaces, among others).
Classification
keywords
special issues asnd sections; microwave photonics; substrates; 5g mobile communication; microwave communication