Electronic International Standard Serial Number (EISSN)
1618-0399
abstract
This article presents the design, construction and performance comparison of three 4×4 Butler matrix technologies working on the Ka-band: standard microstrip, standard microstrip with metasurface packaging and inverted microstrip gap waveguide technology (IM-GWG). Measurement results show that the packaged microstrip and the IM-GWG exhibit less losses, with a good compromise in cost and performance compared to the conventional microstrip Butler matrix.
Classification
subjects
Telecommunications
keywords
butler matrix; inverted microstrip; gap waveguide; microstrip packaged