Thermal conductivity and diffusivity of Cu-Y alloys produced by different powder metallurgy routes Articles uri icon

publication date

  • November 2017

start page

  • 1156

end page

  • 1160

volume

  • 124

international standard serial number (ISSN)

  • 0920-3796

electronic international standard serial number (EISSN)

  • 1873-7196

abstract

  • Full density Cu-1%Y and Cu-0.8%Y alloys have been produced by different powder metallurgy routes and subsequent hot isostatic pressing. Some of the alloys have been subjected to equal channel angular pressing (ECAP) via B-c route up to 8 passes. ECAP deformation homogenizes and refines the microstructure up to attaining a sub-micron grain structure. Thermal properties have been characterized by the laser flash method in the temperature range 373-773 K. The ECAP process, irrespective of the production route, enhanced the thermal conductivity to values similar to those for CuCrZr (ITER grade). The linear thermal expansion coefficient was temperature independent for all materials. (C) 2017 Elsevier B.V. All rights reserved.

keywords

  • copper; yttrium; thermal conductivity; ECAP; MA; coefficient thermal expansion