electronic international standard serial number (EISSN)
Three copper base materials were fabricated following different routes: cast Cu-1 wt.%Y (C-Cu1Y) produced by vacuum induction melting, and Cu-1 wt.%Y (PM-Cu1Y) and Cu-1 wt.%Y2O3 (PM-Cu1Y(2)O(3)) both processed by a powder metallurgy route and sintering by hot isostatic pressing. PM-Cu1Y alloy was prepared by cryomilling and PM-Cu1Y(2)O(3) by conventional milling at room temperature. The materials were characterized by X-ray diffraction, optical and electron microscopy and microhardness measurements. C-Cu1Y presents a characteristic eutectic microstructure while PM-Cu1Y(2)O(3) exhibits a composite like microstructure. Electron microscopy analyses of as-HIP PM-Cu1Y revealed irregular decoration of yttrium-rich oxides at the grain boundaries and an inhomogeneous dispersion of polygonal shaped yttrium-rich oxides dispersed in the Cu matrix. Tensile tests performed on PM-Cu-1Y on the temperature range of 293-773 K have showed a decrease of the yield strength at temperatures higher than 473 K, and monotonically decrease of the ultimate tensile strength and maximum plastic strain on increasing temperature. (C) 2014 Elsevier B.V. All rights reserved.