Electronic International Standard Serial Number (EISSN)
Dispersion strengthened Cu-0.8 wt.%Y has been produced by a powder metallurgy route and subsequent consolidation by hot isostatic pressing at 1123 K and 172 MPa. A fully dense alloy has been obtained that exhibits a microstructure characterized by equiaxed grains with sizes ranging from 0.5 to 50 mu m. Yttrium-rich particles with an average size of 0.92 mu m have been observed inside the grains and decorating the grain boundaries. As expected, the tensile tests carried out from room temperature to 773 K have revealed that both the YS and the UTS decrease with increasing temperature. This alloy exhibits better tensile properties and microhardness than OFHC Cu. This improvement is attributed to the presence of the Y-rich particles.